MUMBAI, India, March 14 -- Intellectual Property India has published a patent application (202617013091 A) filed by Ceracon Gmbh, Weikersheim, Germany, on Feb. 6, for 'method and device for sealing and/or adhesively bonding a substrate.'
Inventor(s) include Kukla, Frank; Weiner, Heiko; and Hayn, Daniel.
The application for the patent was published on March 13, under issue no. 11/2026.
According to the abstract released by the Intellectual Property India: "The invention relates to a method for sealing and/or adhesively bonding a substrate, the method comprising the following steps: a) providing a first substrate; b) applying a one-component thermally cross-linking polyurethane to the first substrate; c) providing a second substrate, where...