MUMBAI, India, Nov. 21 -- Intellectual Property India has published a patent application (202517097171 A) filed by Schunk Sonosystems Gmbh, Wettenberg, Germany, on Oct. 8, for 'method and device for electrically connecting a flexible printed circuit board to a metal element by means of ultrasonic welding.'
Inventor(s) include Hanika, Tim; and Keneder, Mathis.
The application for the patent was published on Nov. 21, under issue no. 47/2025.
According to the abstract released by the Intellectual Property India: "A method for electrically connecting a flexible printed circuit board (3) to a metal element (5) by means of ultrasonic welding and an ultrasonic welding device (1) which can be used to implement the method are described. The flexi...