Intellectual Property India Publishes Patent Application for 'Heterogeneous Integration Platform For Co-Packaged Optics Using Copper-To-Copper Hybrid Bonding And Through-Silicon Vias' Filed by Amity University

MUMBAI, India, Jan. 9 -- Intellectual Property India has published a patent application (202541134696 A) filed by Amity University, Hyderabad, Telangana, on Dec. 31, 2025, for 'heterogeneous integration platform for co-packaged optics using copper-to-copper hybrid bonding and through-silicon vias.'

Inventor(s) include Dr. Praveen Kumar Maduri; Vipin Kumar; and Diwakar Rai.

The application for the patent was published on Jan. 9, under issue no. 02/2026.

According to the abstract released by the Intellectual Property India: "The invention addresses the technical problem of bandwidth scaling limitations in conventional 2.5D interposer approaches, which achieve only 20-30 terabits per second due to parasitic inductance and interconnect densi...