MUMBAI, India, Aug. 8 -- Intellectual Property India has published a patent application (202411004408 A) filed by Chandigarh University; and Chandigarh University Technology Business Incubator, Mohali, Punjab, on Jan. 22, 2024, for 'heat operated workpiece joining device.'
Inventor(s) include Manpreet Singh.
The application for the patent was published on Aug. 8, under issue no. 32/2025.
According to the abstract released by the Intellectual Property India: "A heat operated workpiece joining device, comprising a rectangular shaped frame 1 developed to be installed on a first workpiece that user desire to join with a second workpiece, a pair of primary motorized clamping units 2 attached on frame 1 for gripping first workpiece, a slot 3 c...