Intellectual Property India Publishes Patent Application for 'Heat Dissipation Member And Power Supply Device' Filed by Nidec Mobility Corporation

MUMBAI, India, March 14 -- Intellectual Property India has published a patent application (202514081134 A) filed by Nidec Mobility Corporation, Aichi, Japan, on Aug. 27, 2025, for 'heat dissipation member and power supply device.'

Inventor(s) include Yoshida, Yohei; and Kawakita, Yoichi.

The application for the patent was published on March 13, under issue no. 11/2026.

According to the abstract released by the Intellectual Property India: "The heat dissipation member (1) includes a case (2) that covers the circuit board (4), a refrigerant flow path that is provided on an outer shell of the case (2) and is formed between an inlet (Cin) and an outlet (Cout), and a plurality of fins (11, 12, 13) that extend linearly along the refrigerant fl...