MUMBAI, India, April 20 -- Intellectual Property India has published a patent application (202517090457 A) filed by Asahi Kasei Kabushiki Kaisha, Tokyo, on Sept. 22, 2025, for 'epoxy resin composition, sealing material, semiconductor sealing material, adhesive, camera module, semiconductor package, and electronic apparatus.'
Inventor(s) include Mizuguchi Takuya; Kamimura Naoya; Okamoto Ryosuke; and Otonari Masatoshi.
The application for the patent was published on April 17, under issue no. 16/2026.
According to the abstract released by the Intellectual Property India: "An epoxy resin composition according to the present invention contains an epoxy resin (A) and a curing agent (B), wherein the curing agent (B) is such that when the total ...