Intellectual Property India Publishes Patent Application for 'Easy-To-Tear & Heat Sealable Flexible Packaging Laminate And Film' Filed by Uflex Limited

MUMBAI, India, Jan. 23 -- Intellectual Property India has published a patent application (202511122706 A) filed by Uflex Limited, New Delhi, on Dec. 5, 2025, for 'easy-to-tear & heat sealable flexible packaging laminate and film.'

Inventor(s) include Chaturvedi, Ashok; Chaturvedi, Anantshree; Sirsamkar, Pramod Laxmikantrao; and Ram Gopal.

The application for the patent was published on Jan. 23, under issue no. 04/2026.

According to the abstract released by the Intellectual Property India: "A flexible packaging laminate (200) is disclosed, comprising a polymeric packaging film (100) including a base layer (101) having a top surface (102) and a bottom surface (103), with the top surface (102) provided with micro-indentations (104) that are...