Intellectual Property India Publishes Patent Application for 'Design And Development Of Gluten Free Edible Ink For Structural 3D Food Printing' Filed by J. Thirupaavai; S. Amritha; B. Logesh; N. Sathasivam; and J. S. Sharadha Sree

MUMBAI, India, Jan. 9 -- Intellectual Property India has published a patent application (202541112419 A) filed by J. Thirupaavai; S. Amritha; B. Logesh; N. Sathasivam; and J. S. Sharadha Sree, Coimbatore, Tamil Nadu, on Nov. 17, 2025, for 'design and development of gluten free edible ink for structural 3d food printing.'

Inventor(s) include J. Thirupaavai; S. Amritha; B. Logesh; N. Sathasivam; and J. S. Sharadha Sree.

The application for the patent was published on Jan. 9, under issue no. 02/2026.

According to the abstract released by the Intellectual Property India: "The invention discloses a three-dimensional (30) printable edible ink composition compns1ng jackfruit seed flour, oat powder, honey, and butter, formulated for extrusion-ba...