Intellectual Property India Publishes Patent Application for 'Conductive Lines For Interconnection In Stacked Device Structures' Filed by Bae Systems Information And Electronic Systems Integration Inc.

MUMBAI, India, March 14 -- Intellectual Property India has published a patent application (202517131281 A) filed by Bae Systems Information And Electronic Systems Integration Inc., New Hampshire, U.S.A., on Dec. 24, 2025, for 'conductive lines for interconnection in stacked device structures.'

Inventor(s) include Wyckoff, Nathaniel P.; Terry, Benjamin; Warren, Alexander S; and Waggoner, Joseph.

The application for the patent was published on March 13, under issue no. 11/2026.

According to the abstract released by the Intellectual Property India: "A microelectronics device structure includes a device having (i) a lower surface, (ii) an upper surface opposite the lower surface, and (iii) a side surface extending between the lower surface a...