MUMBAI, India, Oct. 31 -- Intellectual Property India has published a patent application (202411024021 A) filed by Chandigarh University; and Chandigarh University Technology Business Incubator, Mohali, Punjab, on March 26, 2024, for 'automated corn peeling device.'

Inventor(s) include Tek.

The application for the patent was published on Oct. 31, under issue no. 44/2025.

According to the abstract released by the Intellectual Property India: "An automated corn peeling device, comprising a wearable component 1 developed to be worn by a user while peeling a corn, an artificial intelligence-based imaging unit 2 installed on the component 1 for capturing multiple images in vicinity of the component 1 to detect the position of leafy portion of...