Intellectual Property India Publishes Patent Application for 'An Improved Uplink Lower Layer Split Supporting Advanced Comp' Filed by Telefonaktiebolaget LM Ericsson (PUBL)

MUMBAI, India, Nov. 14 -- Intellectual Property India has published a patent application (202517069751 A) filed by Telefonaktiebolaget LM Ericsson (PUBL), Stockholm, on July 22, for 'an improved uplink lower layer split supporting advanced comp.'

Inventor(s) include Lu, Chenguang; Berg, Miguel; Karlsson, Jonas; and Huang, Yezi.

The application for the patent was published on Nov. 14, under issue no. 46/2025.

According to the abstract released by the Intellectual Property India: "Methods and systems are described for performing or assisting in joint equalization, DMRS-based joint equalization, or maximum ratio combining. In certain embodiments, the DU requests the RU to send both the equalized DMRS symbols and the equalized data symbols w...