Intellectual Property India Publishes Patent Application for 'A Rise-Up Packaging Box' Filed by I. T. S Engineering College; Archit Nema; Ashray Mangal; and Dev Khanduja

MUMBAI, India, May 29 -- Intellectual Property India has published a patent application (202611049576 A) filed by I. T. S Engineering College; Archit Nema; Ashray Mangal; and Dev Khanduja, Greater Noida, Uttar Pradesh, on April 18, for 'a rise-up packaging box.'

Inventor(s) include Archit Nema; Ashray Mangal; and Dev Khanduja.

The application for the patent was published on May 29, under issue no. 22/2026.

According to the abstract released by the Intellectual Property India: "The present invention relates to a rise-up packaging box(100). The present invention includes a packaging box(100), a base(102), a lid(104), a pivot edge(106) and an internal engaging surface(108) and a structural stop(110). The base(102) configured to hold the pro...