Intellectual Property India Publishes Patent Application for 'A Process For Additive Manufacturing And Refurbishment Of High-Strength Low-Alloy (HSLA) Components And Components Therefrom' Filed by Technology Innovation In Exploration & Mining Foundation

MUMBAI, India, May 29 -- Intellectual Property India has published a patent application (202631061010 A) filed by Technology Innovation In Exploration & Mining Foundation, Dhanbad, Jharkhand, on May 13, for 'a process for additive manufacturing and refurbishment of high-strength low-alloy (hsla) components and components therefrom.'

Inventor(s) include Dr. Amitava Mandal; and Dr. Shatarupa Biswas.

The application for the patent was published on May 29, under issue no. 22/2026.

According to the abstract released by the Intellectual Property India: "A process for additive manufacturing and refurbishment of High-Strength Low-Alloy (HSLA) components, comprising: a. depositing HSLA filler wire in a layer-by-layer method using a Wire Arc Addit...