MUMBAI, India, May 1 -- Intellectual Property India has published a patent application (202611024963 A) filed by Thapar Institute Of Engineering & Technology, Patiala, Punjab, on March 3, for 'a method to predict the functional properties of metallic foams.'
Inventor(s) include Dr. Rohit Ahuja; Muskan; Dr. Ratnesh Kumar Raj Singh; and Archana Singh.
The application for the patent was published on May 1, under issue no. 18/2026.
According to the abstract released by the Intellectual Property India: "The present invention relates to a method to predict the functional properties of metallic foams that requires the steps of preparing a metal substrate by drilling holes in it and filling the said holes with a foamable mixture. The holes are t...