Intellectual Property India Publishes Patent Application for 'A Hinge Assembly For Enclosure Doors' Filed by Schneider Electric India Private Limited

MUMBAI, India, April 10 -- Intellectual Property India has published a patent application (202411070497 A) filed by Schneider Electric India Private Limited, New Delhi, on Sept. 18, 2024, for 'a hinge assembly for enclosure doors.'

Inventor(s) include Deshpande, Harsha Rugved; and Bhole, Pritesh Kamlakar.

The application for the patent was published on April 10, under issue no. 15/2026.

According to the abstract released by the Intellectual Property India: "The present disclosure envisages a hinge assembly (100) for enclosure doors and a door assembly (200) having the hinge assembly (100). The present disclosure relates to a hinge assembly (100) for a door enclosure in a panel board comprising a hinge mechanism integrated into the door (...