Intellectual Property India Publishes Patent Application for “releasing And Adding Dual Connectivity”

MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202441095752 A) filed by Samsung Electronics Co. , Ltd on January 22, 2025, for “releasing And Adding Dual Connectivity”.

Inventor includes Aby Kanneath Abraham.

The application for the patent was published on July 24, 2026, under issue no. 30/2026.

Abstract: ABSTRACT “RELEASING AND ADDING DUAL CONNECTIVITY” The present invention discloses a method and a user equipment (UE) (200) for releasing and adding dual connectivity. The method includes receiving by UE (200) an MR-DC configuration from a network apparatus and determining by the UE (200) whether an MR-DC release is triggered by reception of MR-DC release and add configuration from the network a...