India, April 19 -- The foundation stone for India's first advanced 3D chip packaging unit was laid on Sunday at Info Valley in Bhubaneswar, marking a major step toward strengthening the country's semiconductor ecosystem.

The project, titled Heterogeneous Integration Packaging Solutions, is being promoted by 3D Glass Solutions and represents a significant push towards the vision of Atmanirbhar Bharat in high-end electronics manufacturing.

Project Launched with Top Leadership

The foundation stone was laid in the presence of Odisha Chief Minister Mohan Charan Majhi and Union Minister Ashwini Vaishnaw.

With this initiative, Odisha is set to host one of the world's most advanced chip packaging technologies.

Calling it a historic milestone...