India, July 15 -- The Union Cabinet today approved the second phase of the Indian Semiconductor Mission, Semicon 2.0, with an outlay of Rs.1.28 Lakh Cr to strengthen India's chip design and manufacturing ecosystem.

The scheme will focus on six areas - chip design; semiconductor equipment and materials; fabrication plants (fabs); assembly, testing, marking and packaging (ATMP)/ outsourced semiconductor assembly and test (OSAT) units; research and development; and talent development.

Under the design pillar, the government plans to expand support for India's chip design ecosystem. The Centre, in a statement, said 105 startups are already developing chips and the new policy will back the development of semiconductor intellectual property (...