Bhubaneswar, April 20 -- The foundation stone for India's first advanced 3D chip packaging unit was laid in Odisha's Bhubaneswar on Sunday. The facility, being set up by a US-based firm at a cost of Rs.1,943 crore, will deploy advanced 3D heterogeneous integration (3DHI) packaging technology which India has so far relied on imports to access. Union IT minister Ashwini Vaishnaw termed the commencement of the project "historic".P8...