Bhubaneswar, April 19 -- Odisha chief minister Mohan Charan Majhi on Sunday laid the foundation stone for India's first glass substrate chip packaging unit in Bhubaneswar to boost the country's semiconductor packaging capabilities.

The facility set up by US-based 3D Glass Solutions Inc. (3DGS) at Info Valley in Bhubaneswar is worth Rs.1,943 crore and will deploy advanced 3D heterogeneous integration (3DHI) packaging technology which India previously relied on imports to access.

Union electronics and IT minister Ashwini Vaishnaw said, "The state is diversifying from metals and minerals to many new industrial bases."

"A high-tech industry coming to Odisha is a matter of pride. This is an advanced technology. Normally, a silicon substrate...