India, July 22 -- Paras Semiconductors has signed a Memorandum of Understanding (MoU) with the Government of Madhya Pradesh to establish an advanced semiconductor packaging and OSAT (Outsourced Semiconductor Assembly and Test) facility in the state. The project, involving a proposed investment of Rs. 6,200 crore, will be developed on 50 acres of land allotted on the Ujjain–Indore Corridor.
The proposed facility is aimed at strengthening India's semiconductor manufacturing ecosystem by developing advanced semiconductor devices for strategic applications, including sensor technologies, optical and optronic systems. The company also sees potential for future expansion into AI chips and other advanced semiconductor technologies as market...