Mumbai, June 11 -- The company said the new facility addresses the fragmented workflow typically associated with silicon photonics packaging, where different stages such as die attach, fibre alignment, wire bonding and testing are often handled by multiple vendors, leading to longer lead times and higher costs.

According to IZMO, the integrated line brings all five key stages of silicon photonics packaging under a single roof, including advanced design, MCM Integration (multi-die/multi-tech), precision fibre alignment, specialised wire bonding and comprehensive testing. The company said the process incorporates proprietary technology co-developed with CPPICS and IIT Madras.

The company estimates that the integrated approach can reduce t...