Taipei, April 23 -- Taiwan Semiconductor Manufacturing Co. (TSMC) unveiled its next-generation A13 process at its North America Technology Symposium in California on Wednesday.

The world's largest contract chipmaker stated that it was targeting volume production for the new technology in 2029. The announcement came during the company's largest annual customer forum, which was held in Santa Clara under the theme "Expanding AI with Leadership Silicon."

According to a report by Focus Taiwan, the new A13 process was aimed at meeting the growing demand for artificial intelligence, high-performance computing, and mobile applications. The company used the symposium to showcase its latest services and technological advancements designed to supp...