Taipei, May 15 -- Taiwan Semiconductor Manufacturing Co (TSMC) showcased progress in its next-generation chipmaking and packaging technologies during the 2026 Taiwan Technology Symposium in Hsinchu on Thursday.

According to a report by Focus Taiwan, the company touted advances in its 2nm process and packaging solutions while highlighting its manufacturing roadmap for the next several years.

Company executives unveiled the new A13, A12, and N2U process technologies and confirmed the mass production of a new chip-on-wafer-on-substrate (CoWoS) packaging solution, which the firm described as the largest in the world.

The announcement regarding production capabilities arrived as the semiconductor industry closely monitored yields from major...