Seoul, May 26 -- SK hynix's iHBM tackles heat choking next-gen high-bandwidth memory (HBM) by building cooling channels directly into its HBM chips. According to a news report by The Korea Herald on Tuesday, the South Korean chipmaker introduced this advanced packaging technology to combat rising temperatures, which represent a significant engineering obstacle that limits how far artificial intelligence memory scales.

HBM is the specialized memory stacked next to AI accelerator chips, and SK hynix is the world's leading supplier of it. As stacks grow taller and faster to feed AI workloads, they generate more heat, and that heat now caps how far the technology can scale. The hottest point sits along the high-speed link between the memory ...