Seoul, Aug. 27 -- South Korean chipmaker SK hynix on Thursday formally launched its USD 3.87 billion advanced chip packaging project in Indiana, a facility that is set to produce the first high bandwidth memory (HBM) in the United States, The Korea Herald reported.

As per report, the groundbreaking ceremony was held at Purdue University in West Lafayette, Indiana, more than two years after SK hynix announced the investment in April 2024.

The plant is expected to complete its clean room in October 2028 and begin mass production in the third quarter of 2029.

It also shared that once operational, the facility will take DRAM chips produced in South Korea and stack and package them into HBM, the high-performance memory used alongside proces...