Seoul, Sept. 1 -- Samsung Electronics unveiled its next-generation memory strategy at Semicon Taiwan, banking on 3D architectures to enhance capacity, bandwidth, and energy efficiency amid mounting artificial intelligence workloads, according to a news report by The Korea Herald.

Choi Jang-seok, head of the memory product planning team at Samsung Electronics, presented the road map during a keynote speech at the Memory Executive Summit in Taipei. The company designated the strategy "CUBE," an acronym for capacity, utilization, bandwidth, and efficiency. Central to this approach is a transition toward vertically integrated structures designed to expand capacity without occupying additional board space.

"We will no longer be constrained b...