New Delhi, Jan. 4 -- Projects supported under the government's Design Linked Incentive (DLI) scheme are scaling rapidly, with 16 tape-outs, 6 ASIC chips, 10 patents, over 1,000 engineers engaged, and over 3x private investment leveraged.

Ministry of Electronics and Information Technology's (MeitY) Design Linked Incentive (DLI) Scheme under the Semicon India Programme aims to build a self-reliant, globally competitive chip design ecosystem.

As many as 24 DLI-supported chip design projects target strategic sectors, including video surveillance, drone detection, energy metering, microprocessors, satellite communications, and IoT SoCs, according to a press release by the Press Information Bureau on Sunday.

India is rapidly advancing its se...