ALEXANDRIA, Va., June 16 -- United States Patent no. 12,654,251, issued on June 16, was assigned to WELDFIT LLC (Houston). "Methods of using induction heating and moisture barriers to perform in-serv... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,654,252, issued on June 16, was assigned to JFE STEEL Corp. (Tokyo). "Element, method of friction element welding, and method of manufacturing ... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,654,253, issued on June 16, was assigned to JIMEI UNIVERSITY (Xiamen City, China). "Method for friction stir processing for the end surface of ... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,654,254, issued on June 16, was assigned to DISCO Corp. (Tokyo). "Facet region detection method and wafer generation method" was invented by Sa... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,654,255, issued on June 16, was assigned to The Procter & Gamble Co. (Cincinnati). "High speed laser processes for marking on articles" was inv... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,654,256, issued on June 16, was assigned to AGC GLASS EUROPE (Louvain-la-neuve, Belgium). "Apparatus and method for removing at least one porti... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,654,257, issued on June 16, was assigned to LG ENERGY SOLUTION LTD. (Seoul, South Korea). "Welding method and welding apparatus for secondary b... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,654,258, issued on June 16, was assigned to DISCO Corp. (Tokyo). "Electrode welding method and electrode welding apparatus" was invented by Yuk... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,654,259, issued on June 16, was assigned to DISCO Corp. (Tokyo). "Diamond substrate manufacturing method" was invented by Naoki Murazawa (Tokyo... Read More
ALEXANDRIA, Va., June 16 -- United States Patent no. 12,654,260, issued on June 16, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan). "Laser processing method and la... Read More