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US Patent Issued to Allegro MicroSystems on June 30 for "Integrated circuit packaging with insulation structure to control gap height and die tilt" (Massachusetts, New Hampshire Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,592, issued on June 30, was assigned to Allegro MicroSystems LLC (Manchester, N.H.). "Integrated circuit packaging with insulation structur... Read More


US Patent Issued to DAIKIN INDUSTRIES on June 30 for "Shell-and-plate heat exchanger" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,669,290, issued on June 30, was assigned to DAIKIN INDUSTRIES LTD. (Osaka, Japan). "Shell-and-plate heat exchanger" was invented by Mitsuharu N... Read More


US Patent Issued to LG Electronics on June 30 for "Plate heat exchanger" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,669,291, issued on June 30, was assigned to LG Electronics Inc. (Seoul, South Korea). "Plate heat exchanger" was invented by Sanghoon Yoo (Seou... Read More


US Patent Issued to HAMILTON SUNDSTRANG on June 30 for "Phase change material heat exchanger" (Connecticut, California Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,669,292, issued on June 30, was assigned to HAMILTON SUNDSTRANG Corp. (Charlotte, N.C.). "Phase change material heat exchanger" was invented by... Read More


US Patent Issued to DELTA ELECTRONICS on June 30 for "Vapor chamber with support structure" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,669,293, issued on June 30, was assigned to DELTA ELECTRONICS INC. (Taoyuan City, Taiwan). "Vapor chamber with support structure" was invented ... Read More


US Patent Issued to TAIWAN MICROLOOPS on June 30 for "Heat dissipation structure combining vapor chamber with heat pipe and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,669,294, issued on June 30, was assigned to TAIWAN MICROLOOPS CORP. (New Taipei City, Taiwan). "Heat dissipation structure combining vapor cham... Read More


US Patent Issued to HEFEI HAIER REFRIGERATOR, HAIER SMART HOME on June 30 for "Heat exchange tube assembly, fabrication method thereof and refrigerator" (Chinese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,669,295, issued on June 30, was assigned to HEFEI HAIER REFRIGERATOR Co. LTD. (Hefei City, China) and HAIER SMART HOME Co. LTD. (Qingdoa City, C... Read More


US Patent Issued to ZHEJIANG DUNAN ARTIFICIAL ENVIRONMENT on June 30 for "Heat exchanger" (Chinese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,669,296, issued on June 30, was assigned to ZHEJIANG DUNAN ARTIFICIAL ENVIRONMENT Co. LTD. (Shaoxing, China). "Heat exchanger" was invented by ... Read More


US Patent Issued to T.RAD on June 30 for "Cup-plate type heat exchanger" (Japanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,669,297, issued on June 30, was assigned to T.RAD Co. LTD. (Tokyo). "Cup-plate type heat exchanger" was invented by Shuhei Matsusaka (Tokyo). ... Read More


US Patent Issued to Schlumberger Technology on June 30 for "Equipment and method using elastic turbulence" (British Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,669,298, issued on June 30, was assigned to Schlumberger Technology Corp. (Sugar Land, Texas). "Equipment and method using elastic turbulence" ... Read More