ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,507,315, issued on Dec. 23, was assigned to QUALCOMM Inc. (San Diego). "Non-uniform-integer positioning and/or sensing behavior" was invented b... Read More
ALEXANDRIA, Va., Dec. 23 -- United States Patent no. D1,106,761, issued on Dec. 23, was assigned to YETI Coolers LLC (Austin, Texas). "Mug" was invented by Dustin R. Bullock (Austin, Texas) and Alexa... Read More
ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,503,806, issued on Dec. 23. "Device for installation on an inner circumferential surface of a washing machine drum" was invented by Boray Torun... Read More
ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,505,744, issued on Dec. 23, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Information processing device, information p... Read More
ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,504,612, issued on Dec. 23, was assigned to FANUC Corp. (Yamanashi, Japan) and I PEACE INC. (Palo Alto, Calif.). "Microscope observation system... Read More
ALEXANDRIA, Va., Dec. 23 -- United States Patent no. D1,106,779, issued on Dec. 23. "Handles of gardening shears" was invented by Shih-Piao Wu (Chang Hua Hsien, Taiwan). The patent was filed on Feb.... Read More
ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,502,784, issued on Dec. 23, was assigned to Sintokogio Ltd. (Aichi, Japan). "Manufacturing system and manufacturing method for manufacturing as... Read More
ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,502,942, issued on Dec. 23, was assigned to Oshkosh Corp. (Oshkosh, Wis.). "Vehicle with reconfigurable energy storage" was invented by Mitchel... Read More
ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,505,783, issued on Dec. 23, was assigned to Beijing BOE Technology Development Co. Ltd. (Beijing). "Information collection module and apparatus... Read More
ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,036, issued on Dec. 23, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Dicing and wafer thinning to form semiconductor dies... Read More