ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,737,301, issued on Sept. 15, was assigned to Intel Corp. (Santa Clara, Calif.). "Software interface to XPU address translation cache" was inve... Read More
ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,737,302, issued on Sept. 15, was assigned to SiFive Inc. (Santa Clara, Calif.). "Concurrent support for multiple cache inclusivity schemes usi... Read More
ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,737,303, issued on Sept. 15, was assigned to Kyndryl Inc. (New York). "Virtual storage mechanism to optimize fetch performance of named object... Read More
ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,737,304, issued on Sept. 15, was assigned to Intel Corp. (Santa Clara, Calif.). "Prioritizing entries of an instruction fetch resource after s... Read More
ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,737,305, issued on Sept. 15, was assigned to 1FINITY Inc. (Kawasaki, Japan) and NTT Inc. (Tokyo). "Data transfer controller and information pr... Read More
ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,737,306, issued on Sept. 15, was assigned to Silicon Motion Inc. (Hsinchu County, Taiwan). "Virtualized parallel access architecture for flash... Read More
ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,737,307, issued on Sept. 15, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Systems and methods for moving data betwee... Read More
ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,737,308, issued on Sept. 15, was assigned to SUZHOU METABRAIN INTELLIGENT TECHNOLOGY Co. LTD. (Suzhou, China). "Data recording method and appa... Read More
ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,737,309, issued on Sept. 15, was assigned to Micron Technology Inc. (Boise, Idaho). "Semiconductor memory device with signaled command/address... Read More
ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,737,310, issued on Sept. 15, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Semiconductor chips and semiconductor packages setting b... Read More