ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,556,201, issued on Feb. 17, was assigned to Avago Technologies International Sales Pte. Ltd. (Singapore). "System and method for low density pa... Read More
ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,551,184, issued on Feb. 17, was assigned to GE Precision Healthcare LLC (Waukesha, Wis.). "Ultrasound imaging method, ultrasound imaging system... Read More
ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,515, issued on Feb. 17, was assigned to Chengdu BOE Optoelectronics Technology Co. Ltd. (Chengdu, China) and BOE TECHNOLOGY GROUP Co. LTD. (... Read More
ALEXANDRIA, Va., Feb. 17 -- United States Patent no. D1,113,138, issued on Feb. 17, was assigned to Shenzhen Shenlongke Technology Co. Ltd. (Guangdong, China). "Case for mouth guard" was invented by ... Read More
ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,551,220, issued on Feb. 17, was assigned to Howmedica Osteonics Corp. (Mahwah, N.J.). "Reamer for augmented glenoid implant" was invented by La... Read More
ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,556,780, issued on Feb. 17, was assigned to Beijing Zitiao Network Technology Co. Ltd. (Beijing). "Live video processing method and apparatus, ... Read More
ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,555,988, issued on Feb. 17, was assigned to NEC Corp. (Tokyo) and NEC Platforms Ltd. (Kanagawa, Japan). "Feedthrough structure and underwater a... Read More
ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,552,140, issued on Feb. 17, was assigned to SIKA TECHNOLOGY AG (Baar, Switzerland). "Sealing device with increased concrete adhesion strength" ... Read More
ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,556,058, issued on Feb. 17, was assigned to AKTIEBOLAGET SKF (Gothenburg, Sweden). "Grounding brush assembly" was invented by Benoit Arnault (S... Read More
ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,622, issued on Feb. 17, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan). "Method for fabricating a semiconductor device with a ... Read More