ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,411,809, issued on Sept. 9, was assigned to Google LLC (Mountain View, Calif.). "Virtual file system for transactional data access and managem... Read More
ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,411,456, issued on Sept. 9, was assigned to PATEK PHILIPPE SA GENEVE (Geneva). "Method of making a timepiece spring from monocrystalline mater... Read More
ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,411,871, issued on Sept. 9, was assigned to Hammel Cos. Inc. (Pittsburgh). "Apparatus and method for generating an automated output as a funct... Read More
ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,411,352, issued on Sept. 9, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Composite diffraction element, instrument, ... Read More
ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,409,105, issued on Sept. 9, was assigned to ENVUE MEDICAL HOLDINGS CORP. (Arlington Heights, Ill.). "Insertion device positioning guidance sys... Read More
ALEXANDRIA, Va., Sept. 10 -- United States Patent no. D1,092,081, issued on Sept. 9. "Electric folding bed" was invented by Xuejiao Shang (Sichuan, China). The patent was filed on March 14, 2025, un... Read More
ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,411,635, issued on Sept. 9, was assigned to Micron Technology Inc. (Boise, Idaho). "Partitions within buffer memory" was invented by Minjian W... Read More
ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,410,287, issued on Sept. 9, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan). "Composite resin molded produc... Read More
ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,408,926, issued on Sept. 9, was assigned to DEPUY SYNTHES PRODUCTS INC. (Raynham, Mass.). "Surgical saw blade" was invented by Stefan Gisler (... Read More
ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,827, issued on Sept. 9, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor die package with... Read More