US Patent Issued to Lanzhou University on Sept. 8 for "Method and device for dust identification utilizing multimodal neural network, and storage device" (Chinese Inventors)

Posted On: 2026-09-08

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,005, issued on Sept. 8, was assigned to Lanzhou University (Lanzhou, China). "Method and device for dust identification utilizing multimoda... Read More

US Patent Issued to SHIMADZU on Sept. 8 for "Raman spectroscopy device" (Japanese Inventors)

Posted On: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,006, issued on Sept. 8, was assigned to SHIMADZU Corp. (Kyoto, Japan). "Raman spectroscopy device" was invented by Tomoyo Tao (Kyoto, Japan... Read More

US Patent Issued to Thermo Fisher Scientific (Shanghai) Instruments, Thermo Fisher Scientific (Bremen) on Sept. 8 for "Peak position measurement offset in a two-dimensional optical spectrum" (Chinese, German Inventors)

Posted On: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,007, issued on Sept. 8, was assigned to Thermo Fisher Scientific (Shanghai) Instruments Co. Ltd. (Shanghai) and Thermo Fisher Scientific (Br... Read More

US Patent Issued to INNOLUX on Sept. 8 for "Sensing device" (Taiwanese Inventors)

Posted On: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,008, issued on Sept. 8, was assigned to INNOLUX Corp. (Chu-Nan, Taiwan). "Sensing device" was invented by Yu-Tsung Liu (Miao-Li County, Tai... Read More

US Patent Issued to NEC on Sept. 8 for "Composite material, bolometer, and composite material forming method" (Japanese Inventor)

Posted On: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,009, issued on Sept. 8, was assigned to NEC Corp. (Tokyo). "Composite material, bolometer, and composite material forming method" was inven... Read More

US Patent Issued to The Hong Kong University of Science and Technology, Board of Regents, The University of Texas System on Sept. 8 for "Prism-free differential interference contrast microscope with tunable beam shear distance" (Chinese, American Inventors)

Posted On: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,010, issued on Sept. 8, was assigned to The Hong Kong University of Science and Technology (Hong Kong) and Board of Regents, The University ... Read More

US Patent Issued to Rosemount on Sept. 8 for "Process temperature sensor with improved thermal isolation" (Minnesota Inventors)

Posted On: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,011, issued on Sept. 8, was assigned to Rosemount Inc. (Shakopee, Minn.). "Process temperature sensor with improved thermal isolation" was ... Read More

US Patent Issued to Skyworks Solutions on Sept. 8 for "Gain compensation for power amplifiers using a temperature sensor circuit" (Canadian, American Inventors)

Posted On: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,012, issued on Sept. 8, was assigned to Skyworks Solutions Inc. (Irvine, Calif.). "Gain compensation for power amplifiers using a temperatu... Read More

US Patent Issued to GIST(Gwangju Institute of Science and Technology) on Sept. 8 for "Resistance-based on-chip temperature sensor" (South Korean Inventors)

Posted On: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,013, issued on Sept. 8, was assigned to GIST(Gwangju Institute of Science and Technology) (Gwangju, South Korea). "Resistance-based on-chip... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Wafer temperature sensor including optical fiber, wafer temperature sensor system, and method of manufacturing wafer temperature sensor" (Japanese Inventors)

Posted On: 2026-09-08

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ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,014, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Wafer temperature sensor including optical f... Read More

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US Patent Issued to Lanzhou University on Sept. 8 for "Method and device for dust identification utilizing multimodal neural network, and storage device" (Chinese Inventors)

US Patent Issued to SHIMADZU on Sept. 8 for "Raman spectroscopy device" (Japanese Inventors)

US Patent Issued to Thermo Fisher Scientific (Shanghai) Instruments, Thermo Fisher Scientific (Bremen) on Sept. 8 for "Peak position measurement offset in a two-dimensional optical spectrum" (Chinese, German Inventors)

US Patent Issued to INNOLUX on Sept. 8 for "Sensing device" (Taiwanese Inventors)

US Patent Issued to NEC on Sept. 8 for "Composite material, bolometer, and composite material forming method" (Japanese Inventor)

US Patent Issued to The Hong Kong University of Science and Technology, Board of Regents, The University of Texas System on Sept. 8 for "Prism-free differential interference contrast microscope with tunable beam shear distance" (Chinese, American Inventors)

US Patent Issued to Rosemount on Sept. 8 for "Process temperature sensor with improved thermal isolation" (Minnesota Inventors)

US Patent Issued to Skyworks Solutions on Sept. 8 for "Gain compensation for power amplifiers using a temperature sensor circuit" (Canadian, American Inventors)

US Patent Issued to GIST(Gwangju Institute of Science and Technology) on Sept. 8 for "Resistance-based on-chip temperature sensor" (South Korean Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Wafer temperature sensor including optical fiber, wafer temperature sensor system, and method of manufacturing wafer temperature sensor" (Japanese Inventors)