Japan, March 25 -- DAIHATSU MOTOR CO LTD has got intellectual property rights for 'DRAWING METHOD.' Other related details are as follows: Application Number: JP,2022-055939 Category (FI): B21D22/22,... Read More
Japan, March 25 -- FURUKAWA ELECTRIC CO LTD:THE,FURUKAWA AUTOMOTIVE SYSTEMS INC has got intellectual property rights for 'WIRE HARNESS WITH TEMPORARY HOLDING MEMBER AND TEMPORARY HOLDING DEVICE.' Othe... Read More
Japan, March 25 -- SAKAI CHEM IND CO LTD has got intellectual property rights for 'OIL-BASED DISPERSION AND COSMETIC.' Other related details are as follows: Application Number: JP,2022-055209 Catego... Read More
Japan, March 25 -- SAKAI CHEM IND CO LTD has got intellectual property rights for 'AQUEOUS DISPERSION AND COSMETIC.' Other related details are as follows: Application Number: JP,2022-055208 Category... Read More
Japan, March 25 -- QUALTEC:KK has got intellectual property rights for 'METHOD OF MANUFACTURING BATTERY.' Other related details are as follows: Application Number: JP,2022-055108 Category (FI): H01M... Read More
Japan, March 25 -- NAGANO KEIKI CO LTD,TOHOKU UNIV has got intellectual property rights for 'ATOM DIFFUSION JOINING METHOD, SENSOR MANUFACTURING METHOD, JOINING MEMBER, AND SENSOR.' Other related deta... Read More
Japan, March 25 -- ASAHI KASEI CORP has got intellectual property rights for 'INSPECTION DEVICE.' Other related details are as follows: Application Number: JP,2022-054952 Category (FI): G01N22/00@J,... Read More
Japan, March 25 -- JOHNAN CORP has got intellectual property rights for 'NETWORK SYSTEM, COMPUTER, AND DEEP LEARNING METHOD.' Other related details are as follows: Application Number: JP,2022-054849 ... Read More
Japan, March 25 -- YOSHINO KOGYOSHO CO LTD has got intellectual property rights for 'SYNTHETIC RESIN ROUND BOTTLE.' Other related details are as follows: Application Number: JP,2022-054839 Category ... Read More
Japan, March 25 -- DIC CORP has got intellectual property rights for 'POLYINDENE COMPOUND, CURABLE COMPOSITION, CURED PRODUCT, PREPREG, CIRCUIT BOARD, BUILD-UP FILM, SEMICONDUCTOR ENCAPSULANT, AND SEM... Read More