ALEXANDRIA, Va., March 17 -- United States Patent no. 12,580,372, issued on March 17, was assigned to Reliance Controls Corp. (Racine, Wis.). "Power inlet box with hybrid construction" was invented b... Read More
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,578,989, issued on March 17, was assigned to Truist Bank (Charlotte, N.C.). "Efficient initiation of automated processes" was invented by Edwa... Read More
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,579,494, issued on March 17, was assigned to Blue Yonder Group Inc. (Scottsdale, Ariz.). "System and method of cognitive risk management" was ... Read More
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,576,602, issued on March 17, was assigned to Huntsman Nanocamp LLC (The Woodlands, Texas). "Method of producing composites" was invented by Ma... Read More
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,578,729, issued on March 17, was assigned to Tencent Technology Co. Ltd. (Shenzhen, China). "Method for building controller for robot, method,... Read More
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,576,743, issued on March 17, was assigned to Panasonic Intellectual Property Management Co. Ltd. (Osaka, Japan). "Charger selection system, ch... Read More
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,575,532, issued on March 17, was assigned to M.S. Technologies LLC (West Point, Iowa). "Soybean cultivar 25280415" was invented by Justin T. M... Read More
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,577,367, issued on March 17, was assigned to The Boeing Co. (Arlington, Va.). "Thermoplastic composition, consolidated laminate structure, and... Read More
ALEXANDRIA, Va., March 17 -- United States Patent no. D1,118,144, issued on March 17. "Portable mirror" was invented by Wei-Cheng Wang (Taipei City, Taiwan). The patent was filed on Dec. 27, 2024, u... Read More
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,913, issued on March 17, was assigned to ANSYS INC. (Canonsburg, Pa.). "Steady-state IC thermal analysis with thermal decay curve characte... Read More