Japan, July 27 -- TAIWAN-ASIA SEMICONDUCTOR CORP has got intellectual property rights for 'WAFER EXPOSURE LAYOUT METHOD.' Other related details are as follows: Application Number: JP,2025-006163 Cat... Read More
Japan, July 27 -- SEMTEK CORP has got intellectual property rights for 'SEMICONDUCTOR CHIP INCLINATION CLEANING METHOD.' Other related details are as follows: Application Number: JP,2025-077051 Cate... Read More
Japan, July 27 -- SEMTEK CORP has got intellectual property rights for 'SEMICONDUCTOR CHIP ORIENTED CLEANING METHOD.' Other related details are as follows: Application Number: JP,2025-077050 Categor... Read More
Japan, July 27 -- SEMICONDUCTOR ENERGY LAB CO LTD has got intellectual property rights for 'SEMICONDUCTOR DEVICE AND DISPLAY DEVICE.' Other related details are as follows: Application Number: JP,2025... Read More
Japan, July 27 -- SANEI R & D CO LTD has got intellectual property rights for 'GAME MACHINE.' Other related details are as follows: Application Number: JP,2025-140212 Category (FI): A63F7/02,320 St... Read More
Japan, July 27 -- SANEI R & D CO LTD has got intellectual property rights for 'GAME MACHINE.' Other related details are as follows: Application Number: JP,2025-140209 Category (FI): A63F7/02,320 St... Read More
Japan, July 27 -- MITSUBISHI CHEMICAL CORP has got intellectual property rights for 'METHOD FOR PRODUCING SILICA SOL AND POLISHING METHOD.' Other related details are as follows: Application Number: J... Read More
Japan, July 27 -- HITACHI LTD has got intellectual property rights for 'AIRSPACE USE MANAGEMENT DEVICE, AIRSPACE USE MANAGEMENT SYSTEM, AND AIRSPACE USE MANAGEMENT METHOD.' Other related details are a... Read More
Japan, July 27 -- SEMICONDUCTOR ENERGY LAB CO LTD has got intellectual property rights for 'SEMICONDUCTOR DEVICE.' Other related details are as follows: Application Number: JP,2025-130052 Category (... Read More
Japan, July 27 -- NAGASAKA SHOJI KK has got intellectual property rights for 'METHOD FOR PRODUCING ASEPTICALLY PACKAGED TOFU.' Other related details are as follows: Application Number: JP,2024-076821... Read More