US Patent Issued to TEXAS INSTRUMENTS on June 9 for "Integrated circuit devices with capacitors for tamper detection" (Texas, California Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,034, issued on June 9, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Integrated circuit devices with capacitors for tamper detection" wa... और पढ़ें

US Patent Issued to SAMSUNG ELECTRONICS on June 9 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,035, issued on June 9, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Inhyung... और पढ़ें

US Patent Issued to Taiwan Semiconductor Manufacturing on June 9 for "Semiconductor device and method" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,036, issued on June 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device and method" was ... और पढ़ें

US Patent Issued to STMICROELECTRONICS on June 9 for "Method of manufacturing semiconductor devices and corresponding semiconductor device" (Italian Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,037, issued on June 9, was assigned to STMICROELECTRONICS S.r.l. (Agrate Brianza, Italy). "Method of manufacturing semiconductor devices and... और पढ़ें

US Patent Issued to Renesas Electronics on June 9 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,038, issued on June 9, was assigned to Renesas Electronics Corp. (Tokyo). "Semiconductor device" was invented by Katsuhiko Kitagawa (Tokyo),... और पढ़ें

US Patent Issued to Taiwan Semiconductor Manufacturing on June 9 for "Semiconductor device and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,039, issued on June 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device and method of fo... और पढ़ें

US Patent Issued to FUJI ELECTRIC on June 9 for "Semiconductor device having wire protecting part" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,040, issued on June 9, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor device having wire protecting part" was inve... और पढ़ें

US Patent Issued to MITSUBISHI ELECTRIC on June 9 for "Power semiconductor apparatus and power conversion apparatus" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,041, issued on June 9, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo). "Power semiconductor apparatus and power conversion apparatus" was... और पढ़ें

US Patent Issued to FUJI ELECTRIC on June 9 for "Semiconductor module, semiconductor device, and vehicle" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,042, issued on June 9, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor module, semiconductor device, and vehicle" w... और पढ़ें

US Patent Issued to SAMSUNG ELECTRONICS on June 9 for "Semiconductor package including heat dissipation structure" (South Korean Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,043, issued on June 9, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package including heat dissipati... और पढ़ें

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