Japan, Jan. 28 -- SHISEIDO CO LTD has got intellectual property rights for 'EMULSION COSMETIC.' Other related details are as follows: Application Number: JP,2024-073469 Category (FI): A61K8/06,A61K8... Read More
Japan, Jan. 28 -- HYUNDAI MOTOR COMPANY CO LTD,KIA CORP has got intellectual property rights for 'SYSTEM AND METHOD FOR SUPPORTING AUTOMATED VALET PARKING, AND INFRASTRUCTURE AND VEHICLE FOR THE SAME.... Read More
Japan, Jan. 28 -- NEC CORP has got intellectual property rights for 'NETWORK DEVICE, TERMINAL DEVICE, AND COMMUNICATION METHOD.' Other related details are as follows: Application Number: JP,2024-0726... Read More
Japan, Jan. 28 -- LEXTAR ELECTRONICS CORP has got intellectual property rights for 'INORGANIC LIGHT-EMITTING DIODE DISPLAY.' Other related details are as follows: Application Number: JP,2024-068792 ... Read More
Japan, Jan. 28 -- ORACLE INTERNATL CORP has got intellectual property rights for 'TECHNIQUES FOR DATA-DRIVEN CORRELATION OF METRICS.' Other related details are as follows: Application Number: JP,2024... Read More
Japan, Jan. 28 -- STRATUS TECHNOLOGIES IRELAND LTD has got intellectual property rights for 'HIGH RELIABILITY FAULT TOLERANT COMPUTER ARCHITECTURE.' Other related details are as follows: Application ... Read More
Japan, Jan. 28 -- DAIO PAPER CORP has got intellectual property rights for 'CUTLERY.' Other related details are as follows: Application Number: JP,2024-063873 Category (FI): A47G21/02@Z,A47G21/04@Z,... Read More
Japan, Jan. 28 -- ORACLE INTERNATL CORP has got intellectual property rights for 'SYSTEMS AND METHODS FOR EFFICIENT VIRTUALIZATION IN LOSSLESS NETWORKS.' Other related details are as follows: Applica... Read More
Japan, Jan. 28 -- NINGDE NEW ENERGY CO LTD,AMPEREX TECHNOLOGY LTD has got intellectual property rights for 'ELECTRODE PIECE, ELECTROCHEMICAL DEVICE, AND ELECTRONIC APPARATUS INCLUDING THE SAME.' Other... Read More
Japan, Jan. 28 -- TOSHIBA CORP has got intellectual property rights for 'HIGH FREQUENCY CIRCUIT.' Other related details are as follows: Application Number: JP,2023-000141 Category (FI): H01P5/107@Z ... Read More