GENEVA, Oct. 5 -- CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED filed a patent application (CN2026/070196) for “BATTERY CELL, PREPARATION METHOD THEREFOR, BATTERY DEVICE, AND ELECTRICAL DEVICE”. With p... Read More
GENEVA, Oct. 5 -- OFFSHORE OIL ENGINEERING (QINGDAO) CO., LTD. filed a patent application (CN2025/147805) for “METHOD FOR SEAM FINDING AND ADAPTIVE DEVIATION CORRECTION IN INTERSECTING-LINE WELDING OF... Read More
GENEVA, Oct. 5 -- SKYBEST ELECTRIC APPLIANCE (SUZHOU) CO., LTD. filed a patent application (CN2025/147917) for “DUST SUCTION DEVICE”. With publication no. WO/2026/200166, here are the other details re... Read More
GENEVA, Oct. 5 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2025/148206) for “DATA PROCESSING METHOD, DATA PROCESSING SYSTEM, AND COMPUTER-READABLE STORAGE MEDIUM”. With publication ... Read More
GENEVA, Oct. 5 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2025/147663) for “METHOD FOR CONTROLLING DEVICE, REMOTE CONTROL, DISPLAY DEVICE, AND SYSTEM”. With publication no. WO/2026... Read More
GENEVA, Oct. 5 -- OFFSHORE OIL ENGINEERING (QINGDAO) CO., LTD. filed a patent application (CN2025/147695) for “TWIN-WIRE WELDING PROCESS PARAMETER PREDICTION METHOD BASED ON MACHINE LEARNING METHOD”. ... Read More
GENEVA, Oct. 5 -- NINGBO BABY FIRST BABY PRODUCTS CO., LTD. filed a patent application (CN2025/147719) for “AUTOMATIC LOCKING MECHANISM AND SAFETY SEAT”. With publication no. WO/2026/200163, here are ... Read More
GENEVA, Oct. 5 -- SF TECHNOLOGY CO., LTD. filed a patent application (CN2025/147258) for “AGV SCHEDULING METHOD, DEVICE, MEDIUM, AND PRODUCT”. With publication no. WO/2026/200156, here are the other d... Read More
GENEVA, Oct. 5 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2025/147393) for “MEDIUM-VOLTAGE POWER DEVICE AND POWER SUPPLY SYSTEM”. With publication no. WO/2026/200158, here are the ... Read More
GENEVA, Oct. 5 -- GOERTEK MICROELECTRONICS INC. filed a patent application (CN2025/147451) for “PIEZOELECTRIC CERAMIC MODULE, PIEZOELECTRIC CERAMIC MODULE PACKAGING METHOD, AND ELECTRONIC DEVICE”. Wit... Read More