US Patent Issued to Intel on April 14 for "Package structures with collapse control features" (Arizona Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,733, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Package structures with collapse control features" was invent... Read More

US Patent Issued to Intel on April 14 for "Package structures with collapse control features" (Arizona Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,733, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Package structures with collapse control features" was invent... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on April 14 for "Integrated circuit packages and methods" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,734, issued on April 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Integrated circuit packages and m... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on April 14 for "Integrated circuit packages and methods" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,734, issued on April 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Integrated circuit packages and m... Read More

US Patent Issued to GLOBALFOUNDRIES U.S. on April 14 for "Device with airgap structure" (Vermont Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,735, issued on April 14, was assigned to GLOBALFOUNDRIES U.S. Inc. (Malta, N.Y.). "Device with airgap structure" was invented by Uppili S.... Read More

US Patent Issued to GLOBALFOUNDRIES U.S. on April 14 for "Device with airgap structure" (Vermont Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,735, issued on April 14, was assigned to GLOBALFOUNDRIES U.S. Inc. (Malta, N.Y.). "Device with airgap structure" was invented by Uppili S.... Read More

US Patent Issued to Intel on April 14 for "Shield to reduce substrate electromagnetic interference and warpage" (Malaysian, American, Indian Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,736, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Shield to reduce substrate electromagnetic interference and w... Read More

US Patent Issued to Intel on April 14 for "Shield to reduce substrate electromagnetic interference and warpage" (Malaysian, American, Indian Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,736, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Shield to reduce substrate electromagnetic interference and w... Read More

US Patent Issued to 3M Innovative Properties on April 14 for "Electronic assembly comprising metal foil layer exposing solder bumps and method for fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,737, issued on April 14, was assigned to 3M Innovative Properties Co. (St. Paul, Minn.). "Electronic assembly comprising metal foil layer ... Read More

US Patent Issued to 3M Innovative Properties on April 14 for "Electronic assembly comprising metal foil layer exposing solder bumps and method for fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,737, issued on April 14, was assigned to 3M Innovative Properties Co. (St. Paul, Minn.). "Electronic assembly comprising metal foil layer ... Read More

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