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US Patent Issued to Azur Space Solar Power on April 7 for "Stacked iii-v multi-junction solar cell" (German Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,817, issued on April 7, was assigned to Azur Space Solar Power GmbH (Heilbronn, Germany). "Stacked iii-v multi-junction solar cell" was inv... Read More


US Patent Issued to ZHEJIANG AIKO SOLAR ENERGY TECHNOLOGY on April 7 for "Doped region structure and solar cell comprising the same, cell assembly, and photovoltaic system" (Chinese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,818, issued on April 7, was assigned to ZHEJIANG AIKO SOLAR ENERGY TECHNOLOGY Co. LTD. (Jinhua, China). "Doped region structure and solar c... Read More


US Patent Issued to Maxeon Solar on April 7 for "Solar cell interconnection wire interconnect structure with strain relief features" (California Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,819, issued on April 7, was assigned to Maxeon Solar Pte. Ltd. (Singapore). "Solar cell interconnection wire interconnect structure with st... Read More


US Patent Issued to Suzhou Maizhan Automation Technology on April 7 for "Method for manufacturing novel busbarless solar photovoltaic module" (Chinese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,820, issued on April 7, was assigned to Suzhou Maizhan Automation Technology Co. Ltd. (Suzhou, China). "Method for manufacturing novel busb... Read More


US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on April 7 for "Chip package structure and method for producing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,821, issued on April 7, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan). "Chip package structure and method for... Read More


US Patent Issued to Aeluma on April 7 for "Stacked focal plane array circuit and method thereof" (California Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,822, issued on April 7, was assigned to Aeluma Inc. (Goleta, Calif.). "Stacked focal plane array circuit and method thereof" was invented b... Read More


US Patent Issued to Powerchip Semiconductor Manufacturing on April 7 for "Image sensor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,823, issued on April 7, was assigned to Powerchip Semiconductor Manufacturing Corp. (Hsinchu, Taiwan). "Image sensor structure" was invente... Read More


US Patent Issued to Powerchip Semiconductor Manufacturing on April 7 for "CMOS image sensor with 3D monolithic OSFET and FEMIM" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,824, issued on April 7, was assigned to Powerchip Semiconductor Manufacturing Corp. (Hsinchu, Taiwan). "CMOS image sensor with 3D monolithi... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on April 7 for "Substrate contact in wafer backside" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,825, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Substrate contact in wafer backside... Read More


US Patent Issued to ZF Friedrichshafen on April 7 for "Image sensor assembly" (Michigan Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,826, issued on April 7, was assigned to ZF Friedrichshafen AG (Friedrichshafen, Germany). "Image sensor assembly" was invented by Thomas E.... Read More