ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,407, issued on July 21, was assigned to SEMES Co. LTD. (Cheonan-si, South Korea) and SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). ... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,408, issued on July 21, was assigned to KIOXIA Corp. (Tokyo). "Substrate processing apparatus and method for manufacturing semiconductor de... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,409, issued on July 21, was assigned to Kyushu University National University Corp. (Fukuoka, Japan) and Gigaphoton Inc. (Tochigi, Japan). ... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,410, issued on July 21, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Semiconductor processing tool platform configuration... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,411, issued on July 21, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Methods and apparatus for processing a substrate" wa... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,412, issued on July 21, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Verifying alignment of multiple die on a sub... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,413, issued on July 21, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Large format continuous imaging system" was invented... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,414, issued on July 21, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate holder, substrate processing system, and substrate transfer... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,415, issued on July 21, was assigned to GSEC GERMAN SEMICONDUCTOR EQUIPMENT COMPANY GMBH (Furtwangen, Germany). "Device and method for hand... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,416, issued on July 21, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate processing method" was invented by Tomohiro Tak... Read More