ALEXANDRIA, Va., March 17 -- United States Patent no. 12,578,306, issued on March 17, was assigned to Battelle Memorial Institute (Richland, Wash.). "Ion extraction and focusing from a field-free reg... और पढ़ें
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,576,311, issued on March 17, was assigned to Tonal Systems Inc. (San Francisco). "Collaborative exercise" was invented by David Azaria (San Fr... और पढ़ें
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,578,230, issued on March 17, was assigned to Axis AB (Lund, Sweden). "Method and device for monitoring of a heap of material" was invented by ... और पढ़ें
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,765, issued on March 17, was assigned to Beijing BOE Sensor Technology Co. Ltd. (Beijing) and BOE Technology Group Co. Ltd. (Beijing). "Ac... और पढ़ें
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,580,767, issued on March 17, was assigned to Capital One Services LLC (McLean, Va.). "Transmission of secure and authenticated data over a net... और पढ़ें
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,580,094, issued on March 17, was assigned to Prysmian S.p.A. (Milan). "Overhead conductors with high-temperature resistant cured coatings" was... और पढ़ें
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,580,352, issued on March 17, was assigned to SENSORVIEW Co. LTD. (South Korea) and OKINS ELECTRONICS Co. LTD. (South Korea). "Plug connector c... और पढ़ें
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,082, issued on March 17, was assigned to DOLBY VIDEO COMPRESSION LLC (San Francisco). "Context initialization in entropy coding" was inven... और पढ़ें
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,576,638, issued on March 17, was assigned to Seiko Epson Corp. (Tokyo). "Liquid ejecting head" was invented by Yoichi Naganuma (Matsumoto, Jap... और पढ़ें
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,599, issued on March 17, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Packaging module, electronic device, and method... और पढ़ें