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US Patent Issued to Samsung Display on April 7 for "Display device with a heat dissipation substrate and a cover substrate" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,038, issued on April 7, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device with a heat dissipation substrat... Read More


US Patent Issued to SHENZHEN JUFEI OPTOELECTRONICS on April 7 for "LED chip module and method for manufacturing LED chip module" (Chinese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,039, issued on April 7, was assigned to SHENZHEN JUFEI OPTOELECTRONICS Co. LTD (Shenzhen, China). "LED chip module and method for manufactu... Read More


US Patent Issued to SAMSUNG ELECTRONICS on April 7 for "Three-dimensional integrated circuit structure and a method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,040, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Three-dimensional integrated circuit structu... Read More


US Patent Issued to Innolux on April 7 for "Communication device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,041, issued on April 7, was assigned to Innolux Corp. (Miaoli County, Taiwan). "Communication device and manufacturing method thereof" was ... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on April 7 for "Carrier structure and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,042, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Carrier structure and methods of fo... Read More


US Patent Issued to Advanced Semiconductor Engineering on April 7 for "Semiconductor device package and method of manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,043, issued on April 7, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Semiconductor device package and meth... Read More


US Patent Issued to SAMSUNG ELECTRONICS on April 7 for "Display module and display device" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,044, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Display module and display device" was inven... Read More


US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on April 7 for "Sensor chips having columnar microstructures embedded and surrounded by adhesive layer in a package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,045, issued on April 7, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan). "Sensor chips having columnar microstr... Read More


US Patent Issued to Samsung Display on April 7 for "Apparatus and method for fabricating display panel, and display panel" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,046, issued on April 7, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Apparatus and method for fabricating display pa... Read More


US Patent Issued to VueReal on April 7 for "Optoelectronic microdevice" (Canadian Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,047, issued on April 7, was assigned to VueReal Inc. (Waterloo, Canada). "Optoelectronic microdevice" was invented by Gholamreza Chaji (Wat... Read More