ALEXANDRIA, Va., April 21 -- United States Patent no. 12,607,660, issued on April 21, was assigned to Rohde & Schwarz GmbH & Co. KG (Munich). "Configurable radio frequency system" was invented by Nic... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,607,661, issued on April 21, was assigned to The United States of America as represented by the Secretary of the Army (Washington). "Simultane... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,607,662, issued on April 21, was assigned to Mitsubishi Electric Research Laboratories Inc.. "Phase identification of power distribution syste... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,607,663, issued on April 21, was assigned to Electric Power Research Institute of Yunnan Power Grid Co. Ltd (Yunnan, China). "Method and syste... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,607,664, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Transmitting and receiving circuit includi... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,607,665, issued on April 21, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Electronic devices related to monitoring of internal nod... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,607,666, issued on April 21, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Electrical and logic isolation for systems on a chip" was inven... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,607,667, issued on April 21, was assigned to Tektronix Inc. (Beaverton, Ore.). "System and method for detection of anomalies in test and measu... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,607,668, issued on April 21, was assigned to Lockheed Martin Corp. (Bethesda, Md.). "Systems and methods for wireless test modules of a wirele... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,607,669, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor chip and semiconductor packa... Read More