ALEXANDRIA, Va., March 17 -- United States Patent no. D1,118,729, issued on March 17. "Microscope" was invented by Yuqiong Xiao (Meizhou, China). The patent was filed on July 2, 2024, under Applicat... Read More
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,579,548, issued on March 17, was assigned to LTI Mindtree Ltd. (Mumbai, India). "Method and system for predicting likelihood of return of a pr... Read More
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,579,042, issued on March 17, was assigned to Rambus Inc. (San Jose, Calif.). "High performance persistent memory" was invented by Frederick A.... Read More
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,577,415, issued on March 17, was assigned to Kraton Corp. (The Woodlands, Texas). "Associative rheology modifier composition and methods for m... Read More
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,576,589, issued on March 17, was assigned to General Electric Co. (Evendale, Ohio). "Print and recoat assemblies for additive manufacturing sy... Read More
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,580,121, issued on March 17, was assigned to CorePower Magnetics Inc. (Pittsburgh). "Inductor for low and medium voltage application" was inve... Read More
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,578,183, issued on March 17, was assigned to HAMAMATSU PHOTONICS K.K. (Hamamatsu, Japan). "Film thickness measuring device and film thickness ... Read More
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,576,009, issued on March 17, was assigned to MannKind Corp. (Danbury, Conn.). "Adapter for a fluid transfer device" was invented by Christophe... Read More
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,582,001, issued on March 17, was assigned to Micron Technology Inc. (Boise, Idaho). "Methods for fusion bonding semiconductor devices to tempo... Read More
ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,668, issued on March 17, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Semiconductor device packages inclu... Read More