INTERNATIONAL PATENT: ACM RESEARCH (SHANGHAI),INC., 盛美半导体设备（上海）股份有限公司 FILES APPLICATION FOR "BUMP ELECTROPLATING METHOD"

Posted On: 2026-01-26

GENEVA, Jan. 26 -- ACM RESEARCH (SHANGHAI) , INC. (BUILDING 4, NO. 1690 CAI LUN ROAD, CHINA (SHANGHAI) PILOT FREE TRADE ZONEPudong New Area, Shanghai 201203), 盛美半导体&... Read More

INTERNATIONAL PATENT: SUNWODA MOBILITY ENERGY TECHNOLOGY CO., LTD., 欣旺达动力科技股份有限公司 FILES APPLICATION FOR "BATTERY PACK AND VEHICLE"

Posted On: 2026-01-26

Government News US Fed News

GENEVA, Jan. 26 -- SUNWODA MOBILITY ENERGY TECHNOLOGY CO., LTD. (Floor 1-2, Building A, Sunwoda Industrial ParkNo. 18 Tangjia South RoadGongming Street, Guangming New District,Shenzhen, Guangdong 5181... Read More

INTERNATIONAL PATENT: PEKING UNIVERSITY SHENZHEN GRADUATE SCHOOL, 北京大学深圳研究生院, PINGSHAN TRANSLATIONAL MEDICINE CENTER,SHENZHEN BAY LABORATORY, 深圳湾实验室坪山生物医药研发转化中心, SHENZHEN BAY LABORATORY, 深圳湾实验室 FILES APPLICATION FOR "PAMAM-PEG-BASED NANOPARTICLES FOR TARGETED PROTEIN DEGRADATION"

Posted On: 2026-01-26

Government News US Fed News

GENEVA, Jan. 26 -- PEKING UNIVERSITY SHENZHEN GRADUATE SCHOOL (Peking University Campus, Shenzhen University Town, Xili Street, Nanshan District,Shenzhen, Guangdong 518055), 北京大&#... Read More

INTERNATIONAL PATENT: BOE TECHNOLOGY GROUP CO., LTD., 京东方科技集团股份有限公司, HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD., 合肥鑫晟光电科技有限公司, BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD., 北京京东方技术开发有限公司 FILES APPLICATION FOR "THIN FILM TRANSISTOR, ARRAY SUBSTRATE AND DISPLAY PANEL"

Posted On: 2026-01-26

Government News US Fed News

GENEVA, Jan. 26 -- BOE TECHNOLOGY GROUP CO., LTD. (No.10 Jiuxianqiao Rd.Chaoyang District, Beijing 100015), 京东方科技集团股份有限&#20... Read More

INTERNATIONAL PATENT: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD. FILES APPLICATION FOR "METHOD OF REDUCING REFERENCE SIGNAL OVERHEAD AND RELEVANT DEVICES"

Posted On: 2026-01-26

Government News US Fed News

GENEVA, Jan. 26 -- GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD. (No. 18, Haibin Road, Wusha, Chang'anDongguan, Guangdong 523860) filed a patent application (PCT/CN2025/098792) for "METHOD OF R... Read More

INTERNATIONAL PATENT: NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD, 华进半导体封装先导技术研发中心有限公司 FILES APPLICATION FOR "CO-PACKAGING OPTICS STRUCTURES AND MANUFACTURING METHODS THEREFOR"

Posted On: 2026-01-26

Government News US Fed News

GENEVA, Jan. 26 -- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD (Huajin Semiconductor Phase 2, No. 2 Jingxian Road, Xinwu DistrictWuxi, Jiangsu 214135), 华进半导体&#23... Read More

INTERNATIONAL PATENT: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED, 腾讯科技（深圳）有限公司 FILES APPLICATION FOR "IMAGE PROCESSING METHOD AND APPARATUS, ELECTRONIC DEVICE, STORAGE MEDIUM AND PROGRAM PRODUCT"

Posted On: 2026-01-26

Government News US Fed News

GENEVA, Jan. 26 -- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED (35/F, Tencent Building, Kejizhongyi Road, Midwest District Of Hi-tech Park, Nanshan DistrictShenzhen, Guangdong 518057), 腾&#357... Read More

INTERNATIONAL PATENT: JIANGSU CONSTCURRENT TECHNOLOGY CO., LTD, 江苏恒流科技有限公司 FILES APPLICATION FOR "CARBON NANOTUBE DISPERSION NOZZLE, DEVICE AND METHOD"

Posted On: 2026-01-26

Government News US Fed News

GENEVA, Jan. 26 -- JIANGSU CONSTCURRENT TECHNOLOGY CO., LTD (Room 101, No. 1 Building, 900 Zhujiang Road, Hi-Tech DistrictSuzhou, Jiangsu 215000), 江苏恒流科技&#263... Read More

INTERNATIONAL PATENT: BOE TECHNOLOGY GROUP CO., LTD., 京东方科技集团股份有限公司 FILES APPLICATION FOR "DISPLAY PANEL AND DISPLAY APPARATUS"

Posted On: 2026-01-26

Government News US Fed News

GENEVA, Jan. 26 -- BOE TECHNOLOGY GROUP CO., LTD. (No.10 Jiuxianqiao Rd.,Chaoyang District, Beijing 100015), 京东方科技集团股份有限&#2... Read More

INTERNATIONAL PATENT: HUAWEI TECHNOLOGIES CO., LTD., 华为技术有限公司 FILES APPLICATION FOR "COMMUNICATION METHOD AND DEVICE AND PROGRAM PRODUCT AND STORAGE MEDIUM"

Posted On: 2026-01-26

Government News US Fed News

GENEVA, Jan. 26 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building,Bantian, Longgang DistrictShenzhen, Guangdong 518129), 华为技术有限公司... Read More

Exclusive

Category

Source

Publication

Byline

Location

INTERNATIONAL PATENT: ACM RESEARCH (SHANGHAI),INC., 盛美半导体设备（上海）股份有限公司 FILES APPLICATION FOR "BUMP ELECTROPLATING METHOD"

INTERNATIONAL PATENT: SUNWODA MOBILITY ENERGY TECHNOLOGY CO., LTD., 欣旺达动力科技股份有限公司 FILES APPLICATION FOR "BATTERY PACK AND VEHICLE"

INTERNATIONAL PATENT: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD. FILES APPLICATION FOR "METHOD OF REDUCING REFERENCE SIGNAL OVERHEAD AND RELEVANT DEVICES"

INTERNATIONAL PATENT: NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD, 华进半导体封装先导技术研发中心有限公司 FILES APPLICATION FOR "CO-PACKAGING OPTICS STRUCTURES AND MANUFACTURING METHODS THEREFOR"

INTERNATIONAL PATENT: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED, 腾讯科技（深圳）有限公司 FILES APPLICATION FOR "IMAGE PROCESSING METHOD AND APPARATUS, ELECTRONIC DEVICE, STORAGE MEDIUM AND PROGRAM PRODUCT"

INTERNATIONAL PATENT: JIANGSU CONSTCURRENT TECHNOLOGY CO., LTD, 江苏恒流科技有限公司 FILES APPLICATION FOR "CARBON NANOTUBE DISPERSION NOZZLE, DEVICE AND METHOD"

INTERNATIONAL PATENT: BOE TECHNOLOGY GROUP CO., LTD., 京东方科技集团股份有限公司 FILES APPLICATION FOR "DISPLAY PANEL AND DISPLAY APPARATUS"

INTERNATIONAL PATENT: HUAWEI TECHNOLOGIES CO., LTD., 华为技术有限公司 FILES APPLICATION FOR "COMMUNICATION METHOD AND DEVICE AND PROGRAM PRODUCT AND STORAGE MEDIUM"