ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,529,876, issued on Jan. 20, was assigned to Nearfield Instruments B.V. (Rotterdam, Netherlands). "Compact optical microscope, metrology device ... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,529,722, issued on Jan. 20, was assigned to United States of America as represented by the Secretary of the Air Force (Wright-Patterson AFB, Ohi... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,529,425, issued on Jan. 20. "Impression material cartridge gasket having air vent hole formed therein" was invented by Hun Jung (Goyang-si, Sou... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,529,411, issued on Jan. 20. "Adapter apparatus for a trailer jack" was invented by Roland Besler (Cambridge, Neb.). According to the abstract*... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,530,267, issued on Jan. 20, was assigned to Databricks Inc. (San Francisco). "Notebook snapshot restore in a serverless setting" was invented b... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,280, issued on Jan. 20, was assigned to QUALCOMM Inc. (San Diego). "Uplink synchronization refinement for inter-cell mobility" was invented... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,527,793, issued on Jan. 20, was assigned to Shenzhen Pharmacin Co. Ltd. (Shenzhen, China). "Pharmaceutical compositions" was invented by Zeren ... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,352, issued on Jan. 20, was assigned to TOYOTA JIDOSHA K.K. (Toyota, Japan). "Vehicle display device, vehicle display method, and non-trans... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,219, issued on Jan. 20, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing apparatus and cleaning method" was invented by M... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,744, issued on Jan. 20, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Packaging module including electromagnetic shield... Read More